UnitySC Raises EUR 48 Mn Funding Round Led by Jolt Capital, the French Government and Supernova Invest

UnitySC announces a successful EUR 48 million funding round led by Jolt Capital, the French Government through French Tech Souveraineté (a program operated by Bpifrance) and Supernova Invest.

Driven by sectors like automotive, IoT or communication devices, demand for electronic chips is rising sharply. Measurements and inspection of wafers at every step of the manufacturing process are becoming ever more critical to ensure minimal rates of failure and increase yield.

Advanced packaging, such as three-dimensional integrated circuits (3DIC), one of the current key drivers for semiconductors performance, can require over 1000 fabrication steps.

With cascading defects, the overall yield can dramatically plummet, making high-speed quality control the best insurance and an ideal way to save energy and reduce costs.

UnitySC is already a reference at many wafer manufacturers and IC foundries, with hundreds of machines installed and a leading position in the field of 3DIC metrology.

Beside advanced packaging measuring, UnitySC offers a full range of equipment dedicated to other types of high-end processes, most notably in patterned and un-patterned defect inspection for compound semiconductors, transparent substrate or specialty devices.