HomeBusiness ›Schmid Group and Calumet Electronics Collaborate to Launch First-Ever US Advanced Substrate Facility

Schmid Group and Calumet Electronics Collaborate to Launch First-Ever US Advanced Substrate Facility

With a shared vision of enhancing domestic manufacturing capabilities, the two industry leaders are pooling their expertise to scale up production capacity and drive innovation in the field of advanced substrates.

February 14, 2024. By Abha Rustagi

Calumet Electronics, an American printed circuit board manufacturer, has joined forces with the Schmid Group to spearhead the establishment of advanced packaging substrate production within the United States. This strategic partnership heralds a new era in domestic technology development and underscores the nation's commitment to bolstering its microelectronics supply chain.

The collaboration between Calumet and Schmid represents a significant milestone in advancing substrate technology within the US, complementing recent governmental support through a grant from the US Department of Defense under DPA Title III. With a shared vision of enhancing domestic manufacturing capabilities, the two industry leaders are pooling their expertise to scale up production capacity and drive innovation in the field of advanced substrates.

Calumet is leading the charge in establishing a cutting-edge manufacturing facility spanning 60,000 square feet, exclusively dedicated to advanced substrate production. This facility, the first of its kind in the US, marks a pivotal moment in advancing substrate technology and bolstering the nation's capabilities in advanced packaging.

Leveraging state-of-the-art process and production technology, the project aims to produce micro SMT (mSAP), semi-additive process (SAP), and embedded trace (ET) on a single versatile platform, enabling the development of next-generation electronic components.

Calumet and Schmid are committed to sustainable manufacturing practices, collaborating on the development of modular, space-efficient approaches that maximize environmental conservation, process efficiency, and cost savings, while minimizing cleanroom footprints.

With an anticipated total capital investment of nearly USD 50 million, the project underscores a significant commitment to strengthening the US supply chain for microelectronics and printed circuit boards, paving the way for long-term industry growth and resilience.

Calumet's endeavor has received substantial backing from the US Department of Defense, with a USD 39.9 million investment through the DPA Title III Program. This grant empowers the partnership to enhance manufacturing capabilities and contribute to national security objectives.

In addition to driving technological advancements, the partnership between Calumet and Schmid prioritizes workforce development, aiming to upskill the US workforce and create sustainable jobs in advanced packaging and substrate manufacturing.

Advanced packaging and substrates are poised to revolutionize the electronics industry, enabling advancements in miniaturization, integration, performance, and energy efficiency. By establishing advanced manufacturing capabilities within the US, Calumet and Schmid are positioned to shape the future of advanced packaging technology, fostering innovation and competitiveness on a global scale.

"The partnership between Calumet and Schmid signals a significant leap forward in advanced packaging and substrate technology, further enhancing the United States' competitive position in the global market," remarked Stephen Vairo, President, and Chief Executive Officer of Calumet Electronics.

Christian Schmid, Chief Executive Officer of Schmid Group, echoed this sentiment, stating, "We are pleased to partner with Calumet to streamline the traditional lab-to-fab transition, in alignment with our shared mission as innovators and sustainable partners to the industry. We will create a lighthouse project in Calumet for the reshoring of technology and production to the US."

With innovation and collaboration at the forefront, Calumet Electronics and Schmid Group are set to pave the way for a new era of advanced substrate manufacturing in the United States, driving economic growth, technological advancement, and national security.
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