HomeEnergy efficiency ›NexWafe Reaches CZ Cell Efficiencies and Advances Ultra-Thin Wafers for Space

NexWafe Reaches CZ Cell Efficiencies and Advances Ultra-Thin Wafers for Space

NexWafe’s EpiNex solar wafers achieved 24.4 percent efficiency on a commercial M6 heterojunction (HJT) cell line, for the first time delivering performance parity with conventional CZ wafers. Modules made from both TopCon and HJT solar cells match or exceed the performance of CZ wafers.

December 19, 2024. By News Bureau

NexWafe GmbH (NexWafe) announced significant breakthroughs in its solar wafer manufacturing technology. The company achieved cell efficiencies equivalent to Czochralski (CZ) wafers in a production environment, marking a major milestone.

Additionally, NexWafe highlighted advancements in ultra-thin wafers for space applications, as well as promising data on next-generation tandem-junction cells, demonstrating the versatility and potential of its EpiNex® technology across multiple cutting-edge applications.

 

NexWafe’s EpiNex solar wafers achieved 24.4 percent efficiency on a commercial M6 heterojunction (HJT) cell line, for the first time delivering performance parity with conventional CZ wafers. Modules made from both TopCon and HJT solar cells match or exceed the performance of CZ wafers.

These milestone results validate that NexWafe’s direct gas-to-wafer process as a seamless drop-in replacement for conventional CZ wafers, while offering the potential for significant cost savings by reducing material waste, lowering energy consumption by 40% and eliminating the saw damage etch process step in cell production. While conventional CZ technology results in 50 percent material waste due to polysilicon losses, EpiNex reduces this waste to under 10 percent, primarily by eliminating wire saw kerf losses.

EpiNex technology is also well-positioned to meet the evolving demands of next-generation solar cells for space applications and tandem-junction cells. These applications require thinner wafers with enhanced thermal stability, precise flatness and superior material quality – capabilities that EpiNex is uniquely designed to provide.

Notably, the oxygen content of EpiNex wafers is 20 times lower than conventional CZ wafers. This enables thermal stability and helps improve cell performance under high-temperature conditions.

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