New line of conductive adhesives

The new line of conductive adhesives is designed to make contact from vias or other conductors in the solar cells to the back contact sheet. The adhesive is stress absorbing to withstand the rigors of thermal cycling and features excellent conductive stability to back contact metallizations during damp heat exposure. The DB-1588 conductive adhesive is designed to cure through the encapsulant lamination and cure process. This material has a 40 percent lower cost than ECM’s standard silver filled product.

The DB-1588 conductive adhesive is the latest addition to Engineered Conductive Materials’ full line of conductive stringer attach adhesives, conductive adhesives for back contact crystalline silicon, thin-film and via fill applications as well as conductive grid inks for photovoltaic applications.

For more information about the DB-1588 Conductive Back Contact Adhesive or to learn how Engineered Conductive Materials can define, develop and create an engineered material solution that is right for your company, please visit www.conductives.com